AUXILIARY JIG FOR SURFACE INSPECTION AND SAME POINT MEASURING METHOD USING IT

摘要

PROBLEM TO BE SOLVED: To provide an auxiliary jig for making possible same point measurement and a same point measuring method of a semiconductor substrate not fulfilling the size corresponding to semiconductor surface inspection equipment. SOLUTION: The auxiliary jig used by surface inspection equipment at the time of inspecting the surface of a substrate not fulfilling the size corresponding to the instrument comprises a section for containing the substrate and having a size corresponding to the surface inspection equipment, and a section for securing the substrate contained in the containing section. A marked semiconductor substrate not fulfilling the size corresponding to the equipment is contained in the auxiliary jig and the coordinate of a particle or a defect on the surface of the substrate is measured by the surface inspection equipment (A, B). When the coordinate is measured again, an external computer performs alignment by converting the coordinate based on the coordinate of the mark position (C, D and E), and then same point measurement is performed for a particle or a defect on the surface of the substrate measured at first based on the coordinate conversion data (F).