发明名称 |
MOUNTING METHOD OF ELECTRONIC COMPONENT TO WIRING CIRCUIT BODY AND MOUNTING STRUCTURE THEREOF |
摘要 |
<p>PROBLEM TO BE SOLVED: To provide a method for mounting an electronic component to a wiring circuit body capable of mounting an electronic component with no solder. SOLUTION: A connection conductor 5 is so superposed in a flat insulator 1 as to correspond to a flat wiring conductor 2 which is insulated from and provided to a flexible wiring circuit body 3. Each crimp piece 7 of a connection piece 6 so penetrates the flexible wiring circuit body 3 over the connection conductor 5. The tip of each crimp piece 7 which has penetrated the flexible wiring circuit body 3 is curved and caulked so that the connection conductor 5 is secured to the flexible wiring circuit body 3. Thus, the connection conductor 5 is connected to the flat wiring conductor 2 for electric continuity using the connection piece 6.</p> |
申请公布号 |
JP2003142796(A) |
申请公布日期 |
2003.05.16 |
申请号 |
JP20010334936 |
申请日期 |
2001.10.31 |
申请人 |
FURUKAWA ELECTRIC CO LTD:THE |
发明人 |
ENOMOTO KENJI;SAKATA KAZUMASA;SUZUKI YOSHIYUKI;TAMAOKI KAZUYA;NAKATANI YOSHIMI;FUJISAKI ATSUSHI |
分类号 |
H01R4/24;H05K1/18;H05K3/32;(IPC1-7):H05K1/18;H01R12/32 |
主分类号 |
H01R4/24 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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