| 摘要 |
PROBLEM TO BE SOLVED: To prevent the problem that an optical semiconductor element is not able to dissipate efficiently the heat generated when the element is operated to the outside and, consequently, thermal breakage occurs in the element. SOLUTION: The optical semiconductor element comprises a substrate 1, a frame body 2 having a through hole 2a and a notched section 2b in its side sections and composed of an iron-nickel-cobalt or iron-nickel alloy, and a fixing member 6 to which an optical fiber member 8 is joined. The semiconductor element also comprises a ceramic terminal body 9 in which a wiring layer is formed on a ceramic insulator 10 and a lid member 3. The substrate 1 is composed of 55-90 wt.% cubic boron nitride and 10-45 wt.% copper. |
