| 摘要 |
PROBLEM TO BE SOLVED: To provide a multi-layered printed wiring board which solves the problem that a copper wiring pattern is given large damage in a final soft etching process and inter-line insulation reliability is low since a base copper layer between copper wiring pattern which becomes unnecessary can not be completely removed. SOLUTION: A manufacturing method for a multi-layered printed wiring board is characterized in that a pattern forming process of forming the copper wiring patterns, etc., by a transfer process of plating which forms a plating film in a recessed pattern of a transfer plate which is covered with an insulating layer except the recessed pattern, a sticking process for an insulating substrate as a 2nd layer, a 2nd transfer process, and a via-hole forming process are repeated as many times as needed. |
