| 摘要 |
PROBLEM TO BE SOLVED: To provide a characteristic value measuring apparatus, a characteristic value measuring method, and a probe contact method that can appropriately control probe pressure in a probe that comes into contact with a wafer when measuring a characteristic value near the surface of the wafer. SOLUTION: Strain in a leaf spring 13 is detected by a strain sensor 15 that is stuck to the leaf spring 13, the detected strain signal is amplified by a strain-measuring instrument 16 for converting it to digital data, and the digital strain data are recorded to a data recorder 18 or are displayed at a display section 17. Additionally, the characteristic value measuring apparatus 1 drives a drive section 50 based on the strain data, and the height of a stage 30 is automatically adjusted so that preferable probe pressure is achieved.
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