发明名称 SHEET HEAT TREATMENT DEVICE AND HEAT TREATMENT METHOD
摘要 PROBLEM TO BE SOLVED: To provide a heat treatment device and a heat treatment method by which a preheated member can be prevented from being damaged and heat treatment can be appropriately conducted. SOLUTION: This heat treatment device 100 is provided with a heat treatment container 1 where a susceptor 2 on which a wafer W is placed and a preheated member 6 surrounding the outer circumference of the susceptor are arranged inside and a gas supply inlet 4 is formed, and a heater 3 to heat the wafer W that is placed on the susceptor from the outside of the heat treatment container 1. In this case, the preheated member 6 is formed like a major arc surrounding a half or larger of the outer circumference of the susceptor 2.
申请公布号 JP2003142408(A) 申请公布日期 2003.05.16
申请号 JP20010335154 申请日期 2001.10.31
申请人 SHIN ETSU HANDOTAI CO LTD 发明人 YAMADA TORU
分类号 C23C16/46;H01L21/205;H01L21/302;H01L21/3065;(IPC1-7):H01L21/205;H01L21/306 主分类号 C23C16/46
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