| 摘要 |
PURPOSE: To achieve space saving and a larger throughput. CONSTITUTION: A plurality of supporting bodies 50, 52, etc., are disposed within the same sputtering chamber 14. The supporting bodies are provided with different kinds of targets 70a, 70b, 70c, 72a, 72b, 72c, etc. The targets of the same kinds are mounted in the same order on the supporting bodies with each other. The respective supporting bodies are rotated and the targets of the same kinds necessary for deposition are selected and are opposed to substrates 12 and 12'. One film is deposited by simultaneously using a plurality of the targets of the same kinds. Next, the respective supporting bodies are rotated and the next targets are selected and the next film is laminated on the previous film. Cleaning of the targets not used in the deposition is possible with a cleaning device during this deposition.
|
