发明名称 |
METHOD OF ASSEMBLING AN ADHESIVELY BONDED ELECTRONIC DEVICE USING A DEFORMABLE SUBSTRATE |
摘要 |
<p>The present invention relates to a deformable substrate assembly for microelectronic components which includes an array of ductile metal circuit traces on a surface thereof. When an electronic component is adhesively bonded to the substrate assembly, and bonding elements from the component contact the traces, the substrate has material properties which allow individual bonding elements to locally deform the traces until the traces penetrate into the substrate surface.</p> |
申请公布号 |
HK1012521(A1) |
申请公布日期 |
2003.05.16 |
申请号 |
HK19980113887 |
申请日期 |
1998.12.17 |
申请人 |
MINNESOTA MINING AND MANUFACTURING COMPANY |
发明人 |
HOGERTON, PETER B.;CARLSON, KENNETH E. |
分类号 |
H01L21/58;H01L21/60;H01L23/14;H01L23/532;H01L23/538;(IPC1-7):H01L |
主分类号 |
H01L21/58 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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