| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a wiring board where deformation due to heat is hard to occur in an IC loading board after an IC chip is loaded on the surface of the board in the wiring board where electronic parts are stored in the board. SOLUTION: The wiring board 10 is provided with a board surface 102 having a loading region 105 where the IC chip IC 1 is a loaded, and a board backside 103. The board 10 also has a ceramic core board 111 which is formed of ceramic, and has a through hole 115 just below the loading region 105. Electronic parts 121 are stored in the through hole 115, and the hole is filled with a filling material 129. A resin insulating layer 141 is formed on the surface 112 of a core, and an IC connection terminal 107 is formed in the loading region 105.</p> |
