发明名称 METHOD FOR FORMING RESIN COMPOSITE MATERIAL
摘要 <p>PURPOSE: To provide a method for forming a resin composite material and a resin composite material. CONSTITUTION: This method for forming a resin composite material comprises (1) a step to treat the surface of a carrier resin by introducing an ion exchange group, (2) a step to treat the surface of the carrier resin with the help of a metallic ion-containing solution to introduce a metallic ion, (3) a step to invert the metallic ion to a metallic element-containing component, (4) a step to form a metallic foil with the carrier resin by forming a metallic foil on the metallic element-containing component and (5) a step to transfer the metallic foil to a resin substrate by heating the metallic foil with the carrier resin. In addition, this method enables the metallic foil with the carrier resin having a copper foil of an optional thickness to be formed, so that it is possible to laminate and cast the metallic foil, especially the copper foil with a specified thickness, especially a thickness of 8μm or less on the resin substrate, although handling the foils of the described thickness is conventionally difficult.</p>
申请公布号 KR20030038368(A) 申请公布日期 2003.05.16
申请号 KR20020065056 申请日期 2002.10.24
申请人 SHIPLEY COMPANY, L.L.C 发明人 SEITA MASARU;TSUCHIDA HIDEKI;IMANARI MASAAKI;YOMOGIDA KOICHI;NAWAFUNE HIDEMI
分类号 C23C28/00;B32B15/08;B32B15/088;B32B15/20;B32B37/12;B32B38/00;B32B38/10;H05K3/00;H05K3/02;(IPC1-7):C23C28/00 主分类号 C23C28/00
代理机构 代理人
主权项
地址