发明名称 ELECTROFORMING SYSTEM AND ELECTROFORMING METHOD
摘要 An electroforming system and an electroforming method in which shaping of an electroforming body especially, counter-boring in a hollow section can be carried out easily and accurately. An air supply unit 11 is disposed in an electroforming bath 1 and an air bubble layer 12 is formed on the liquid level 3 of electroforming liquid 2. A tapered part 52 is formed at the upper end of a primary electroforming body 51 in the air bubble layer 12 by controlling up/down movement of a bus 50. A counter bore part 55 copying the tapered part 52 is formed in the hollow section 54 of a secondary electroforming body 53 by forming the secondary electroforming body 53 on the primary electroforming body 51 and the bus 50.
申请公布号 WO03031693(A8) 申请公布日期 2003.05.15
申请号 WO2001JP08540 申请日期 2001.09.28
申请人 OPTICAL FORMING CORPORATION;ODA, TOKUJI;ITIKAWA, YUTAKA 发明人 ODA, TOKUJI;ITIKAWA, YUTAKA
分类号 C25D1/02;C25D17/00;(IPC1-7):C25D1/02 主分类号 C25D1/02
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