发明名称 |
ELECTROFORMING SYSTEM AND ELECTROFORMING METHOD |
摘要 |
An electroforming system and an electroforming method in which shaping of an electroforming body especially, counter-boring in a hollow section can be carried out easily and accurately. An air supply unit 11 is disposed in an electroforming bath 1 and an air bubble layer 12 is formed on the liquid level 3 of electroforming liquid 2. A tapered part 52 is formed at the upper end of a primary electroforming body 51 in the air bubble layer 12 by controlling up/down movement of a bus 50. A counter bore part 55 copying the tapered part 52 is formed in the hollow section 54 of a secondary electroforming body 53 by forming the secondary electroforming body 53 on the primary electroforming body 51 and the bus 50. |
申请公布号 |
WO03031693(A8) |
申请公布日期 |
2003.05.15 |
申请号 |
WO2001JP08540 |
申请日期 |
2001.09.28 |
申请人 |
OPTICAL FORMING CORPORATION;ODA, TOKUJI;ITIKAWA, YUTAKA |
发明人 |
ODA, TOKUJI;ITIKAWA, YUTAKA |
分类号 |
C25D1/02;C25D17/00;(IPC1-7):C25D1/02 |
主分类号 |
C25D1/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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