发明名称 |
Leadframe resistance device and process for the same |
摘要 |
A leadframe resistance structure comprises: at least a resistance foil; a plurality of leads, each of the plurality of leads respectively having a first lead surface and an opposite second lead surface, wherein the resistance foil is disposed on the first lead surface of the leads and connected to the leads; and an encapsulating material that encapsulates the resistance foil, and a portion of the first surface of the leads.
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申请公布号 |
US2003090361(A1) |
申请公布日期 |
2003.05.15 |
申请号 |
US20020229494 |
申请日期 |
2002.08.27 |
申请人 |
LIU STEVEN;JUANG HORNG-YIH;SHIAO YIH-WEN;FAN CHENG-ER |
发明人 |
LIU STEVEN;JUANG HORNG-YIH;SHIAO YIH-WEN;FAN CHENG-ER |
分类号 |
H01C1/012;H01C1/14;H01C17/28;(IPC1-7):H01C1/012;H01C17/00 |
主分类号 |
H01C1/012 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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