发明名称 Leadframe resistance device and process for the same
摘要 A leadframe resistance structure comprises: at least a resistance foil; a plurality of leads, each of the plurality of leads respectively having a first lead surface and an opposite second lead surface, wherein the resistance foil is disposed on the first lead surface of the leads and connected to the leads; and an encapsulating material that encapsulates the resistance foil, and a portion of the first surface of the leads.
申请公布号 US2003090361(A1) 申请公布日期 2003.05.15
申请号 US20020229494 申请日期 2002.08.27
申请人 LIU STEVEN;JUANG HORNG-YIH;SHIAO YIH-WEN;FAN CHENG-ER 发明人 LIU STEVEN;JUANG HORNG-YIH;SHIAO YIH-WEN;FAN CHENG-ER
分类号 H01C1/012;H01C1/14;H01C17/28;(IPC1-7):H01C1/012;H01C17/00 主分类号 H01C1/012
代理机构 代理人
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