发明名称 |
Copper powder for electrically conductive paste |
摘要 |
When copper powder manufactured by a wet reduction method is kneaded with resin in a high filling rate, it is difficult to maintain a low viscosity. The invention is to solve the problem of high viscosity without changing the characteristics such as particle size and specific surface area of the copper powder obtained by a wet reduction method. This invention relates to copper powder for an electrically conductive paste wherein copper powder manufactured by a wet reduction method is subjected to a surface-flattening treatment in which the particles are mechanically collided each other.
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申请公布号 |
US2003089199(A1) |
申请公布日期 |
2003.05.15 |
申请号 |
US20020319529 |
申请日期 |
2002.12.16 |
申请人 |
SANO KAZUSHI;OKADA YOSHIHIRO;MIYOSHI HIROMASA |
发明人 |
SANO KAZUSHI;OKADA YOSHIHIRO;MIYOSHI HIROMASA |
分类号 |
B22F1/00;B22F9/24;H05K1/09;(IPC1-7):C22C1/04 |
主分类号 |
B22F1/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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