Semiconductor device, semiconductor packaging method, assembly and method for fabricating the same

摘要

A semiconductor device includes a semiconductor element having a plurality of element electrodes and a ball electrode electrically connected to at least one element electrode out of the plurality of element electrodes. The ball electrode is made of a Sn-Zn-based lead-free solder including 7 through 9.5 wt % of zinc and the remaining of tin.