| 摘要 |
An apparatus 100 and method for removing materials, such as photoresist, on surfaces of objects, such as semiconductor wafers, utilizes one or more integrated dry-wet processing modules 102A, 102B, 102C to selectively perform plasma ashing and wet-chemical cleaning processes. Thus, a customized combination of plasma ashing and wet-chemical cleaning processes can be performed on a single platform to achieve desired processing results on the objects. In an embodiment, the apparatus may also include a critical dimension inspection unit to inspect the objects that are being processed by the apparatus.
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