发明名称 |
ELECTRICALLY ISOLATED VIA IN A MULTILAYER CERAMIC PACKAGE |
摘要 |
A method for forming an electrically isolated via in a multilayer ceramic package and an electrical connection formed within the via are disclosed. The method includes punching a first via (30) in a first layer (10), filling the first via with a cross-linkable paste (40), curing the paste to form an electrical insulator precursor and forming the via in the insulator precursor. The electrical connection formed includes an insulator made from a cross-linked paste supported by a substrate of a multilayer ceramic package and a conductive connection supported by the insulator. |
申请公布号 |
WO0247148(A3) |
申请公布日期 |
2003.05.15 |
申请号 |
WO2001US43858 |
申请日期 |
2001.11.19 |
申请人 |
MOTOROLA, INC. |
发明人 |
BURDON, JEREMY, W.;MIESEM, ROSS, A.;KORIPELLA, CHOWDARY, RAMESH |
分类号 |
H01L21/48;H05K1/03;H05K3/40 |
主分类号 |
H01L21/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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