| 摘要 |
<p>A sintered body having high thermal conductivity principally comprising diamond and exhibiting excellent characteristics as a heat sink for an electronics element, e.g. a semiconductor laser or a high-performance MPU (microprocessing unit), its producing method and a heat sink employing that sintered body. In particular, a heat sink being suitable for mounting a large-size semiconductor element having a high thermal load, e.g. a high-output semiconductor laser or a high-performance MPU, and providing a high thermal conductivity matching thermal expansion can be provided. Since the characteristics of thermal conductivity and thermal expansion can be regulated relatively freely, an optimal heat sink can be selected according to the features and design of an element being mounted.</p> |
