发明名称 |
PACKAGE ENCLOSING MULTIPLE PACKAGED CHIPS |
摘要 |
A multi-package module package includes a plurality of individually packaged chips. Yield is increased over conventional multi-chip packages because the individual chips can be inexpensively and fully tested before being placed into the multi-package module package. Also, the manufacturing process is simpler because the individual chips can be more easily handled while being tested and attached to the multi-package module package. Further, a standard component surface mount process is used for package assembly. Thus, no new capital investment or process development is needed. |
申请公布号 |
WO03039974(A2) |
申请公布日期 |
2003.05.15 |
申请号 |
WO2002US36032 |
申请日期 |
2002.11.07 |
申请人 |
XILINX, INC. |
发明人 |
CHEE, SOON-SHIN;ZHANG, LEILEI |
分类号 |
H01L25/10;H05K1/14;H05K3/28;H05K3/34 |
主分类号 |
H01L25/10 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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