发明名称 Additive composition, slurry composition including the same, and method of polishing an object using the slurry composition
摘要 An additive composition for a slurry contains a first salt of polymeric acid including a first polymeric acid having a first weight average molecular weight and a first base material, and a second salt of polymeric acid including a second polymeric acid having a second weight average molecular weight and a second base material. A slurry composition is prepared by mixing the additive composition, a polishing particle composition, and water. When implementing a chemical mechanical polishing using the slurry composition, a favorable polishing selectivity is realized.
申请公布号 US2003092265(A1) 申请公布日期 2003.05.15
申请号 US20020293918 申请日期 2002.11.14
申请人 KIM NAM-SOO;CHON SANG-MUN;LIM YOUNG-SAM;KANG KYOUNG-MOON;LEE SEI-CHEOL;SO JAE-HYUN;LEE DONG-JUN 发明人 KIM NAM-SOO;CHON SANG-MUN;LIM YOUNG-SAM;KANG KYOUNG-MOON;LEE SEI-CHEOL;SO JAE-HYUN;LEE DONG-JUN
分类号 B24B37/00;C08L101/02;C09G1/02;C09K3/14;H01L21/304;H01L21/3105;(IPC1-7):H01L21/302;H01L21/461 主分类号 B24B37/00
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