发明名称 |
Additive composition, slurry composition including the same, and method of polishing an object using the slurry composition |
摘要 |
An additive composition for a slurry contains a first salt of polymeric acid including a first polymeric acid having a first weight average molecular weight and a first base material, and a second salt of polymeric acid including a second polymeric acid having a second weight average molecular weight and a second base material. A slurry composition is prepared by mixing the additive composition, a polishing particle composition, and water. When implementing a chemical mechanical polishing using the slurry composition, a favorable polishing selectivity is realized. |
申请公布号 |
US2003092265(A1) |
申请公布日期 |
2003.05.15 |
申请号 |
US20020293918 |
申请日期 |
2002.11.14 |
申请人 |
KIM NAM-SOO;CHON SANG-MUN;LIM YOUNG-SAM;KANG KYOUNG-MOON;LEE SEI-CHEOL;SO JAE-HYUN;LEE DONG-JUN |
发明人 |
KIM NAM-SOO;CHON SANG-MUN;LIM YOUNG-SAM;KANG KYOUNG-MOON;LEE SEI-CHEOL;SO JAE-HYUN;LEE DONG-JUN |
分类号 |
B24B37/00;C08L101/02;C09G1/02;C09K3/14;H01L21/304;H01L21/3105;(IPC1-7):H01L21/302;H01L21/461 |
主分类号 |
B24B37/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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