发明名称 DRAM has bonding pads arranged on east/west band on peripheral region along two opposing sides of DRAM and outermost power supply pads arranged near center of north/south band
摘要 The DRAM has bonding pads arranged on the east/west band on peripheral region along two opposing sides of the DRAM and outermost power supply pads (11,12) arranged near center of the north/south band.
申请公布号 DE10228544(A1) 申请公布日期 2003.05.15
申请号 DE2002128544 申请日期 2002.06.26
申请人 MITSUBISHI DENKI K.K., TOKIO/TOKYO 发明人 SUWA, MAKOTO;JINBO, SHINICHI;TIAN, ZENGCHENG;OKAMOTO, TAKEO;ISHIDA, KOZO;YONETANI, HIDEKI;NAGASAWA, TSUTOMU;YAMAUCHI, TADAAKI;MATSUMOTO, JUNKO
分类号 G11C11/407;G11C5/06;G11C7/00;G11C11/34;G11C11/401;H01L21/60;H01L23/48;H01L23/50;H01L23/52;H01L27/10;H03K3/356;(IPC1-7):G11C7/00 主分类号 G11C11/407
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