发明名称 Molding assembly for wafer scale molding of protective caps
摘要 A mold assembly (100) formed of a pair of molds (102, 104) and a pair of release plates (118, 120). The molds (102, 104) have holes (126) which extend from outer surfaces into the mold cavities (106). The release plates (118, 120) have pins (122, 124) which pass into the holes (126, 128). When molding is finished, the molds (102, 104) are moved toward the release plates (118, 120). The pins (122, 124) contact the molded article(s) (134) and hold them in position as the molds (102, 104) are withdrawn.
申请公布号 US2003091674(A1) 申请公布日期 2003.05.15
申请号 US20020129504 申请日期 2002.05.06
申请人 SILVERBROOK KIA 发明人 SILVERBROOK KIA
分类号 B29C51/30;B29C35/08;B29C43/18;B29C43/36;B29C43/50;B29C51/44;B29L31/34;H01L21/48;H01L21/56;H01L23/04;H01L23/08;(IPC1-7):B29C45/14 主分类号 B29C51/30
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