发明名称 Lead frame, resin sealing mold and method for manufacturing a semiconductor device using the same
摘要 The preferred embodiments provide a lead frame wherein a first air vent 29 and a second air vent 30 are formed in an air vent forming region 32. When resin-molding, one end of this first air vent 29 is disposed within the cavity, whereby air in the cavity when resin-molding can be completely released to the outside of the cavity. As a result, a package after resin-molding includes no unfilled regions or voids, whereby a semiconductor device with excellent product quality can be provided. In the background, air in cavities could not be completely released when resin-molding since, for instance, one air vent was provided at a position apart from the cavity region, and unfilled regions or voids were created.
申请公布号 US2003090877(A1) 申请公布日期 2003.05.15
申请号 US20020291815 申请日期 2002.11.12
申请人 OCHIAI ISAO;ONDA KAZUMI 发明人 OCHIAI ISAO;ONDA KAZUMI
分类号 B29C45/34;B29C45/14;B29L31/34;H01L21/56;H01L23/495;H01L23/50;(IPC1-7):H05K7/20 主分类号 B29C45/34
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