发明名称 |
Cooling element for modern high-efficiency semiconductor devices has cooling fins arranged on flat side of baseplate, and which have end faces on inflow and outflow sides constructed to enhance flow dynamics |
摘要 |
Cooling fins (6) are arranged on a flat side of a baseplate to form flow channels (16). The end faces on the inflow and outflow sides (12,14) of the cooling fins are constructed to enhance flow dynamics.
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申请公布号 |
DE10153512(A1) |
申请公布日期 |
2003.05.15 |
申请号 |
DE2001153512 |
申请日期 |
2001.10.30 |
申请人 |
SIEMENS AG |
发明人 |
HOFFMANN, INGOLF;SCHINN, VOLKER |
分类号 |
F28F3/02;H01L23/467;(IPC1-7):F28F3/02 |
主分类号 |
F28F3/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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