发明名称 |
SUBSTRATE PROCESSING APPARATUS AND METHOD |
摘要 |
There is provided a substrate processing apparatus and method which employs the so-called batch processing method of processing a plurality of substrates simultaneously, thereby increasing the throughput, and which can carry out processing, such as electroless plating, stably and securely with a relatively simple apparatus. The substrate processing apparatus includes: a processing bath (14) for holding a processing liquid (12); and a substrate holder (16) which is vertically movable relative to the processing bath (14) and which includes a plurality of substrate holding portions (40) for holding a plurality of substrates (W) in parallel; wherein each substrate holding portion (40) has a substrate stage (48) and a substrate presser (54), which can move close to or away from each other and can grip therebetween a peripheral portion of a substrate to thereby hold the substrate with its back surface sealed, and has a heating medium flow passage (62) for passing a heating medium therethrough so as to regulate the temperature of the substrate holding portion (40).
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申请公布号 |
WO03040430(A1) |
申请公布日期 |
2003.05.15 |
申请号 |
WO2002JP11573 |
申请日期 |
2002.11.06 |
申请人 |
EBARA CORPORATION;WANG, XINMING;ABE, KENICHI;MISHIMA, KOJI |
发明人 |
WANG, XINMING;ABE, KENICHI;MISHIMA, KOJI |
分类号 |
C23C18/31;C23C18/16;H01L21/288;H01L21/3205;H01L21/768;H01L23/52;(IPC1-7):C23C18/31 |
主分类号 |
C23C18/31 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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