| 摘要 |
Disclosed is an assembly system for stationing a semiconductor wafer suitable for processing said wafer, said system comprising: (a) a holding block; (b) a semiconductor wafer; and (c) an aqueous adhesive composition interposed between said ceramic block and said semiconductor wafer, said adhesive composition comprising water; at least one release agent selected from the group consisting of polyethylene glycols, fluorine-free ethoxylated surfactants, fluorosurfacants, and silicone polymers; and at least one resin selected from the group consisting of (meth)acrylic acid or (meth)acrylate based polymers, vinyl acetate polymers, rosin-modified maleic resins, novolak resins, and polymers represented by the formula wherein each R1, R2, and R3 independently is hydrogen or methyl; R is a hydrocarbyl group of 1 to 4 carbon atoms; each R4 and R5 independently is hydrogen or a hydrocarbyl group of 1 to 4 carbon atoms; R6 is hydrocarbyl group of 1 to 20 carbon atoms; w, x, y, and z independently are a number from 1 to 100; wherein said adhesive composition adheres more strongly to said holding block than to said semiconductor wafer. Also disclosed is a process for manufacturing a semiconductor wafer, comprising the steps of: (a) providing a holding block; (b) providing a semiconductor wafer; (c) coating said holding block or one side of said semiconductor wafer with the foregoing aqueous adhesive composition; (d) contacting one side of said semiconductor wafer to said coated holding block or said coated side of said semiconductor wafer to said holding block, such that said semiconductor wafer adheres to said coated holding block; (e) polishing the other side of said semiconductor wafer; and (f) removing the semiconductor wafer from the coated ceramic holding block.
|
