CERAMIC WAFERBOARD

摘要

An optoelectronic module 1 includes a ceramic waferboard 2 having a groove 3 configured to passively position an optical fiber 4. The ceramic waferboard 2 includes an alignment feature configured to passively position an optical component. An optical device 8 is secured to the ceramic waferboard 2 in contact with the alignment feature to thereby position the optical device 8. An optical fiber 4 is positioned in the groove 3 with an end of the optical fiber 4 positioned adjacent the optical device 8 to thereby optically couple the optical fiber 4 to the optical device 8. The optoelectronic module 1 also includes an integrated circuit chip 11 secured to the ceramic waferboard 2, and a conductive material disposed on the ceramic waferboard 2 and electrically coupling the integrated circuit chip 11 to the optical device 8.