| 摘要 |
The invention relates to a radiant heating method and assembly for a multi-chamber vacuum-soldering system for vacuum-soldering components to substrates in a vacuum chamber. Said assembly comprises a heating device and a device for transporting the substrate carrier. According to the method, short-wave radiation is first produced, said radiation being subsequently converted in the vacuum chamber (1) into long-wave radiation for heating the components/substrates. The inventive heating device consists of a radiating element (14), which generates short-wave primary radiation and emits said radiation to a black radiating element, a graphite plate (10) in the vacuum chamber (1), said black radiating element converting the short-wave primary radiation into long-wave secondary radiation and being situated directly below the substrate carrier (7).
|
