| 摘要 |
<p>The housing [1] has a multi layer heat sink [4-6] produced of high conductivity metal ,eg aluminium, and held together by screws [7]. Within the housing there is a mother board [9] on which there is a socket [11] for a processor chip [12]. This is in firm contact with a high thermal conductivity block that has a thermal energy transmitting tube [19] that is in contact with the heat sink.</p> |
