ELEKTRONISCHE VORRICHTUNG MIT EINER AUF EINEM TRÄGER BEFESTIGTEN SCHALTUNG, UND HERSTELLUNGSVERFAHREN

摘要

The thin electronic chips (2) and adhesive layers (10) are initially attached to a support structure which is then divided. Individual electronic chips with their adhesive layers are then located on to a support surface (16a) and a communications interface (18) is applied to the chip bump terminals (8). The assembly is completed by a protective film (20) which may be applied directly or by pulverization of an agent in liquid phase