SOLDER JET DEVICE AND SOLDERING METHOD

摘要

PROBLEM TO BE SOLVED: To eliminate or reduce the generation of a so-called bridge in a soldering step of a wiring board with positions for soldering close to each other in a solder jet device and a soldering method in which molten solder is jetted out of a plurality of nozzles toward the wiring board to be soldered which is carried in a predetermined direction. SOLUTION: The nozzles 8 are long through holes formed in the direction inclined by a predetermined angle to the carrying direction A of the wiring board P.