| 摘要 |
PROBLEM TO BE SOLVED: To solve problems that solder in a solder tank does not flow in an immersion type soldering device, the temperature of the solder is different depending on a part in the solder tank, the composition of the solder is distributed irregularly, a molten solder surface is waved and cannot be kept flat while the molten solder is smoothly stirred by a pump comprising an impeller. SOLUTION: A moving magnetic field apply means 3 is provided on the bottom 2 of a solder tank 1 to constitute a magnetic solder circulation means, the moving magnetic field of the moving magnetic field apply means 3 is applied to the solder 5 to circulate and stir the solder 5. |
