| 摘要 |
PROBLEM TO BE SOLVED: To provide a film deposition apparatus suitable for depositing a thin film on a substrate surface. SOLUTION: This film deposition apparatus comprises an introduction pipe for continuously feeding a wire-like or granular material together with a gas, an induction heating unit comprising a cylindrical insulator in which a tip side of the introduction pipe is inserted from one side, a heating coil is wound around the entire outer circumference, and a heater is provided inside, and an ionizing unit comprising a second cylindrical insulator in which one end side thereof is brought into contact with or close to the induction heating unit, and a high frequency coil is wound around the outer circumference thereof.
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