A millimeter wave multilayer phased array assembly (18) has a multilayer board (30) consisting of several laminated printed wiring boards (PWBs) and a frame (20) having a waveguide input (22) and a waveguide output (24). The PWBs are made of a high frequency laminate material and have a pattern of metalization to perform varying electronic tasks. These tasks include electrical interconnection, RF signal transmission, DC current routing and DC signal routing. <IMAGE>
申请公布号
EP1094541(A3)
申请公布日期
2003.05.14
申请号
EP20000122700
申请日期
2000.10.18
申请人
HUGHES ELECTRONICS CORPORATION
发明人
DEMORE, WALTER R.;HOLLOWAY, RICHARD A.;HOLMES, BRUCE A.;JOHNSON, BENJAMIN T.;LONDRE, DALE A.;NAKAMURA, LLOYD Y.