发明名称 CUTTING OR POLISHING SLURRY COMPOSITION AND USE THEREOF
摘要 <p>PROBLEM TO BE SOLVED: To provide a slurry composition which contains abrasive grains but can be left for a long time with no hard sediment formed or no coagulation of grain brought about. SOLUTION: The cutting or polishing slurry composition comprises an abrasive grain and a carrier component for cutting or polishing a work piece made of a hard and brittle material, wherein the carrier component contains (a) a nonaqueous nonionic polar solvent at a content of from 80 wt.% to 99.5 wt.%, (b) an organic electrolyte adjusted to pH 4.5-8 at that of form 0.05 wt.% to 10 wt.%, and (c) water at that of from 0.5 wt.% to 10 wt.%.</p>
申请公布号 JP2003138248(A) 申请公布日期 2003.05.14
申请号 JP20010318675 申请日期 2001.10.16
申请人 PPT RESEARCH INC 发明人 BROADWAY SUSAN;FRENCH DANIELLE;HELLER AMY;WARD IRL E
分类号 B24B37/00;C09K3/14;H01L21/304;(IPC1-7):C09K3/14 主分类号 B24B37/00
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