发明名称 METHOD AND DEVICE FOR SPLITTING BRITTLE MATERIAL AND METHOD OF MANUFACTURING ELECTRONIC COMPONENT
摘要 <p>PROBLEM TO BE SOLVED: To provide a method of splitting a work to be split capable of improv ing working efficiency and splitting precision, and to provide a device for the same. SOLUTION: In the method of splitting the work 1 and the device for the same, a crack formed on a starting point 7a on the work 1 is progressed along a predetermined splitting line 12 by heating with a heat source 4, wherein, the shape of a heating spot S is formed on a lower end of a hollow pipe 5 in an elliptical shape, the long axis of which is aligned with the predetermined splitting line 12, the elliptical heating spot S is moved along the predetermined splitting line 12 so as to continuously progress the crack.</p>
申请公布号 JP2003137578(A) 申请公布日期 2003.05.14
申请号 JP20010337586 申请日期 2001.11.02
申请人 SEIKO EPSON CORP 发明人 YOSHIMURA KAZUTO;UMETSU KAZUNARI
分类号 B23K26/00;B23K26/06;B23K26/073;B23K26/40;B23K101/36;B23K101/40;C03B33/07;C03B33/09;(IPC1-7):C03B33/09 主分类号 B23K26/00
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