发明名称 MOLD FOR ELECTRONIC PART BY SEALING IN RESIN
摘要 PROBLEM TO BE SOLVED: To efficiently prevent the deformation or cutting of a wire or the voids or the like of a resin molded product from being generated. SOLUTION: An outflow part 8 for flowing a molten resin 10 out of a mold pot 4 is formed at one spot in the mold pot 4 and resin passages 7a and 7b for transferring the molten resin 10 after diverting the resin 10 into two different flow directions from the outflow part 8, are constituted so that the resin transfer distances 9a and 9b of the resin passages 7a and 7b are the same. Thus the molten resin 10 is equally injected into the mold cavities 2(2a) and 2(2b) through the resin passages 7a and 7b.
申请公布号 JP2003136563(A) 申请公布日期 2003.05.14
申请号 JP20010341452 申请日期 2001.11.07
申请人 TOWA CORP 发明人 TAKASE SHINJI
分类号 B29C45/27;B29C45/14;B29C45/32;B29L31/34;H01L21/56;(IPC1-7):B29C45/27 主分类号 B29C45/27
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