发明名称 |
JET TYPE AUTOMATIC SOLDERING DEVICE |
摘要 |
PROBLEM TO BE SOLVED: To obtain the fixed level of jetted molten solder, to prevent the degradation of solderability, and to allow lead-free solder to be usable in a jet type automatic soldering device used for soldering an electronic component to a printed board. SOLUTION: A nozzle 9 to jet out molten solder in a solder tank 2 containing the molten solder is provided, and a fan 6 to jet out solder from the nozzle 9 is driven by a motor 11. The level of the jetted molten solder is measured by a solder level sensor 14, and the intensity of a jet is controlled by controlling the motor 11 by a control means 15. The control means 15 controls the motor 11 based on an input signal from the solder level sensor 14 so that the solder level is fixed. |
申请公布号 |
JP2003136233(A) |
申请公布日期 |
2003.05.14 |
申请号 |
JP20010337675 |
申请日期 |
2001.11.02 |
申请人 |
MATSUSHITA ELECTRIC IND CO LTD |
发明人 |
SATO SHINICHI;HAMADA HIRONORI;MASUMOTO GOICHI;SAKAGUCHI MASAMI |
分类号 |
B23K3/06;B23K1/08;B23K101/42;H05K3/34;(IPC1-7):B23K1/08 |
主分类号 |
B23K3/06 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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