发明名称 JET TYPE AUTOMATIC SOLDERING DEVICE
摘要 PROBLEM TO BE SOLVED: To obtain the fixed level of jetted molten solder, to prevent the degradation of solderability, and to allow lead-free solder to be usable in a jet type automatic soldering device used for soldering an electronic component to a printed board. SOLUTION: A nozzle 9 to jet out molten solder in a solder tank 2 containing the molten solder is provided, and a fan 6 to jet out solder from the nozzle 9 is driven by a motor 11. The level of the jetted molten solder is measured by a solder level sensor 14, and the intensity of a jet is controlled by controlling the motor 11 by a control means 15. The control means 15 controls the motor 11 based on an input signal from the solder level sensor 14 so that the solder level is fixed.
申请公布号 JP2003136233(A) 申请公布日期 2003.05.14
申请号 JP20010337675 申请日期 2001.11.02
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 SATO SHINICHI;HAMADA HIRONORI;MASUMOTO GOICHI;SAKAGUCHI MASAMI
分类号 B23K3/06;B23K1/08;B23K101/42;H05K3/34;(IPC1-7):B23K1/08 主分类号 B23K3/06
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