| 摘要 |
PROBLEM TO BE SOLVED: To provide a boiling/cooling device of a simple structure with higher reliability and higher cooling capacity. SOLUTION: The boiling/cooling device A stores a refrigerant which boils and evaporates by absorbing the heat generated from a communication board arranged on the surface. The device connects a radiator 3 without a fin to the top of a flat-shaped refrigerant tank erected and arranged in a casing 1, condenses refrigerant vapor by heat dissipation to the atmosphere, and mounts a duct 4 to the radiator 3.
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