PHOTOSENSITIVE POLYMER COMPOSITION, METHOD FOR MANUFACTURING RELIEF PATTERN, AND ELECTRONIC PARTS

摘要

PROBLEM TO BE SOLVED: To provide a positive heat-resistant photosensitive polymer composition having high sensitivity and resolution, forming a pattern with a favorable profile and requiring a short developing time and to provide a method for manufacturing a relief pattern and electronic parts with high reliability by using the composition. SOLUTION: The photosensitive polymer composition contains (a) a polyimide acid ester or polyimide soluble with an alkali aqueous solution, (b) a compound which generates an acid by light and (c) a compound having a phenolic hydroxyl group. The component (a) is a polyamide acid ester having the repeating unit expressed by general formula (I). In the formula, R<1> represents a tetravalent organic group, R<2> represents a bivalent organic group having a carboxyl group or a phenolic hydroxyl group, and each of two R<3> independently represents a monovalent organic group. The method for manufacturing a relief pattern includes a process of applying the above photosensitive polymer composition onto a supporting substrate. The electronic parts have the relief pattern obtained by the above method as a surface protective film or an interlayer insulating film.