发明名称 METHOD FOR CORRECTING PATTERN OF PHASE INVERSION MASK AND PHASE INVERSION MASK CORRECTED BY USING THE SAME
摘要 <p>PROBLEM TO BE SOLVED: To provide a method for correcting the pattern of a phase inversion mask and to provide a phase inversion mask manufactured by using the method. SOLUTION: First, a phase inversion mask having a pattern regularly and repeatedly formed on a mask main body made of a planar transparent material is measured for the error in the pattern to recognize a corrected pattern. In order to correct the pattern error, the mask plate face is etched to specified depth to form a recessed part according to the corrected pattern in the position adjacent to the pattern. Then a phase inversion substance is vapor deposited to a specified thickness in the recessed part to induce the complete phase inversion. Therefore, when the pattern is to be corrected on the phase inversion mask, the complete corrected pattern is obtained by etching the mask plate face to form a recessed part in the position where the corrected pattern is to be formed and then subjecting the recessed part to the vapor deposition of the phase inversion substance. Thus, the reliability of photo processes can be enhanced.</p>
申请公布号 JP2003140316(A) 申请公布日期 2003.05.14
申请号 JP20020307123 申请日期 2002.10.22
申请人 SAMSUNG ELECTRONICS CO LTD 发明人 CHOI YO-HAN
分类号 G03F1/68;G03F1/72;G03F1/74;H01L21/027;(IPC1-7):G03F1/08 主分类号 G03F1/68
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