| 摘要 |
PROBLEM TO BE SOLVED: To flatten a surface to be polished uniformly irrespective of initial, global irregularities of the surface to be polished, such as uneven thickness of the surface of a wafer or the like, to efficiently polish the surface to be polished to a desired amount in a short time, and to miniaturize a device. SOLUTION: Pad mounting parts 13-15 are provided to be rotatable about a rotational center axis J and movable relative to one another along the axis J. Respective pad mounting surfaces or bottom surfaces of the pad mounting parts 13-15 form regions concentric with the axis J without overlapping one another when viewed from the wafer 1. Annular polishing pads 16, 17 and circular polishing pad 18 are attached to the respective bottom surfaces of the pad mounting parts 13-15. The peripheral polishing pad 18 has an outside diameter smaller than a diameter of the wafer 1. Load between each of the polishing pads 16-18 and the wafer 1 is set independently. |
