发明名称 RETAINING RING FOR CHEMICAL-MECHANICAL POLISHING HEAD, POLISHING APPARATUS, SLURRY CYCLE SYSTEM, AND METHOD
摘要 <p>In a chemical-mechanical polishing machine (101) where a polishing head (100) holds a wafer (150) against a polishing pad (140), a retaining ring (300) that surrounds the wafer (150) has an open chamber (350) to distribute pressurized slurry (144) to the polishing pad (140) and to the periphery (153) of the wafer (150).</p>
申请公布号 EP1309422(A1) 申请公布日期 2003.05.14
申请号 EP20010960557 申请日期 2001.07.25
申请人 INFINEON TECHNOLOGIES SC300 GMBH & CO. KG 发明人 GLASHAUSER, WALTER
分类号 B24B37/32;B24B57/02;H01L21/304;(IPC1-7):B24B37/04 主分类号 B24B37/32
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