发明名称 LASER BEAM MACHINING DEVICE
摘要 <p>PROBLEM TO BE SOLVED: To provide a laser beam machining device compact in size and superior in a machining speed as well as machining quality. SOLUTION: First and second acousto-optic deflection elements 2a, 2b are arranged between a laser oscillator 1 and first and second galvano scanner system 3, 4. The movement of the laser beam 1a in a long stroke is performed by the first and second galvano scanner systems 3, 4 while a short stroke is moved by the first and second acousto-optic deflection elements 2a, 2b.</p>
申请公布号 JP2003136270(A) 申请公布日期 2003.05.14
申请号 JP20010338203 申请日期 2001.11.02
申请人 HITACHI VIA MECHANICS LTD 发明人 SAKAMOTO ATSUSHI;MORI SADAO;OTSUKI HARUAKI;TOYAMA SOICHI;OKUBO YAICHI;MURAKAMI TETSUO;UENO HIDEO;OISHI MASAHIRO
分类号 G02B26/10;B23K26/06;B23K26/08;B23K101/42;G02F1/33;(IPC1-7):B23K26/08 主分类号 G02B26/10
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