发明名称 |
LASER BEAM MACHINING DEVICE |
摘要 |
<p>PROBLEM TO BE SOLVED: To provide a laser beam machining device compact in size and superior in a machining speed as well as machining quality. SOLUTION: First and second acousto-optic deflection elements 2a, 2b are arranged between a laser oscillator 1 and first and second galvano scanner system 3, 4. The movement of the laser beam 1a in a long stroke is performed by the first and second galvano scanner systems 3, 4 while a short stroke is moved by the first and second acousto-optic deflection elements 2a, 2b.</p> |
申请公布号 |
JP2003136270(A) |
申请公布日期 |
2003.05.14 |
申请号 |
JP20010338203 |
申请日期 |
2001.11.02 |
申请人 |
HITACHI VIA MECHANICS LTD |
发明人 |
SAKAMOTO ATSUSHI;MORI SADAO;OTSUKI HARUAKI;TOYAMA SOICHI;OKUBO YAICHI;MURAKAMI TETSUO;UENO HIDEO;OISHI MASAHIRO |
分类号 |
G02B26/10;B23K26/06;B23K26/08;B23K101/42;G02F1/33;(IPC1-7):B23K26/08 |
主分类号 |
G02B26/10 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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