发明名称 SOLDER JET WAVEFORM FORMING DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a solder jet waveform forming device which forms a stable waveform using an electromagnetic pump, heightens total efficiency equal to that of a pump driven by a motor, and easily and reliably perform cleaning work or the like. SOLUTION: The electromagnetic pump 12 is immersed in solder 5 with a suction port 34 directed to the surface 5a of the solder 5 in a solder tank 1, and the solder 5 is fed to a blowing body 15 to form a jet wave 27 of the solder 5 with a blow port 37 directing above the surface 5a. An internal core 19 of the electromagnetic pump 12 is provided in an advancing/retracing manner from the surface 5a of the solder 5 to easily clean the inside of the electromagnetic pump 12.
申请公布号 JP2003136230(A) 申请公布日期 2003.05.14
申请号 JP20010336279 申请日期 2001.11.01
申请人 NIHON DENNETSU KEIKI CO LTD 发明人 TOBA HIDEAKI
分类号 B23K1/08;B23K101/42;H05K3/34;(IPC1-7):B23K1/08 主分类号 B23K1/08
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