| 摘要 |
PROBLEM TO BE SOLVED: To efficiently remove impurities in a solder material which increases in accordance with an operation in the flow soldering technology. SOLUTION: In a flow soldering device, the flow of the solder material 50 stared and thermal-fused in a solder vessel 20 is brought into contact with an object P to be soldered. The method for removing impurities the solder material comprises a process (a) of sending the solder material 50 in the solder vessel 20 to an impurity treatment vessel 16, a process (b) of locally fusing the solder material 50 by a heater 60, etc., in the treatment vessel 16, and at the same time, continuously moving a thermal fusion position from one end side of the treatment vessel 16 to the other end side thereof and accumulating the impurities 52 on the solder material 50 at the end of the treatment vessel 16 and a process (c) of removing the solder material 50 in which the impurities 52 are accumulated and sending back the solder material 50 in the treatment vessel 16 to the solder vessel 20.
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