发明名称 |
Wafer support having a dustproof covering film |
摘要 |
A dustproof covering film-attached wafer support comprising a base, a silicone rubber layer substantially uniform in thickness and integrated with the base and a dustproof covering film, with the dustproof covering film is attached to the silicone rubber layer in a state that the peel strength between the dustproof covering film and the silicone rubber layer is from 5 to 500 g/25 mm, thereby enabling the covering film to be peeled apart as the need arises; and a production method for such a wafer support.
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申请公布号 |
US6563195(B1) |
申请公布日期 |
2003.05.13 |
申请号 |
US20000672054 |
申请日期 |
2000.09.29 |
申请人 |
SHIN-ETSU CHEMICAL CO., LTD. |
发明人 |
TOMARU KAZUHIKO;YONEYAMA TSUTOMU;HANDA RYUICHI |
分类号 |
H01L21/683;H01L21/00;H01L21/68;H01L21/687;(IPC1-7):G02F1/133;B05D5/10;B32B31/06;B32B7/06 |
主分类号 |
H01L21/683 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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