| 摘要 |
A LED packaging process is to place LED chips at predetermined positions on the printed circuit board substrate, followed by drilling holes to penetrate the substrate, followed by passing the printed circuit board through the solder furnace to completely fill the through-hole position with solder points, followed by using molds to make the soldering points into a groove reflector, followed by placing LED chips in the groove reflector, followed by wire bonding and using encapsulation resin for packaging to form SMD LED with reflectors. In the present invention, the filling with metal conductor in electrode through holes on the printed circuit board to form the groove reflector can enhance the heat dissipation of LED and the brightness of LED, which has the advantageous effects that traditional SMD LED can not have.
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