| 发明名称 |
Product using Zn-Al alloy solder |
| 摘要 |
There is provided an electronic device comprising at least one electronic part and a substrate on which said electronic part is mounted, said electronic part and said substrate being bonded by a joint comprising a phase of Al particles and another phase of a Al-Mg-Ge-Zn alloy, said Al particles being connected to each other by said Al-Mg-Ge-Zn alloy phase. |
| 申请公布号 |
US6563225(B2) |
申请公布日期 |
2003.05.13 |
| 申请号 |
US20020083543 |
申请日期 |
2002.02.27 |
| 申请人 |
HITACHI, LTD. |
发明人 |
SOGA TASAO;ISHIDA TOSHIHARU;MIURA KAZUMA;HATA HANAE;OKAMOTO MASAHIDE;NAKATSUKA TETSUYA |
| 分类号 |
B22F1/00;B23K1/00;B23K35/02;B23K35/14;B23K35/28;C22C18/00;C22C18/02;C22C18/04;H01L21/60;H05K3/34;(IPC1-7):H01L23/48 |
主分类号 |
B22F1/00 |
| 代理机构 |
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