| 发明名称 |
Printed circuit board and method for manufacturing same |
| 摘要 |
In a multilayer printed circuit board having a conductor pattern, covered with an insulation layer having via holes, these via holes are filled with a conductor by means of electroless nickel plating or electroless copper plating.
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| 申请公布号 |
US6563057(B2) |
申请公布日期 |
2003.05.13 |
| 申请号 |
US20000501296 |
申请日期 |
2000.02.09 |
| 申请人 |
NEC TOPPAN CIRCUIT SOLUTIONS, INC. |
发明人 |
HOTTA SINICHI;TAKAHASHI HISAYA |
| 分类号 |
H05K1/11;H05K3/00;H05K3/18;H05K3/42;H05K3/46;(IPC1-7):H05K1/11 |
主分类号 |
H05K1/11 |
| 代理机构 |
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代理人 |
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| 主权项 |
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