发明名称 |
Process for manufacturing a flat coil |
摘要 |
A process for manufacturing a flat coil for use as the write head in a magnetic disk system is disclosed. The process starts with a blanket seed layer which is coated with a photoresist frame that defines the shape of the coil. The latter is then electroformed from the seed layer within the confines of said frame. Key features of the invention include capping the coil with a layer of gold to protect it during the removal of copper that is exposed after photoresist removal, using reactive ion etching to convert the exposed copper to the chloride (which is then easily rinsed away), and then removing all last traces of chlorides through an ashing process.
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申请公布号 |
US6560864(B1) |
申请公布日期 |
2003.05.13 |
申请号 |
US20010992517 |
申请日期 |
2001.11.14 |
申请人 |
HEADWAY TECHNOLOGIES, INC. |
发明人 |
CHANG JEI-WEI;JU KOCHAN |
分类号 |
H01F17/00;H01F41/04;H05K1/16;H05K3/06;H05K3/10;H05K3/38;(IPC1-7):H05K3/02 |
主分类号 |
H01F17/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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